Engineering Technologies Associates Dynaform 7.0.0

Engineering Applications

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  • Saadedin
    Thread Author
    • Sep 2018 
    • 35957 
    • 18,452 
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    ETA Dynaform 7.0.0 Build 2023.03.31 (x64)

    DYNAFORM is a simulation software solution, which allows organizations to bypass soft tooling, reducing overall tryout time, lowering costs, increasing productivity & providing complete confidence in die system design. It also allows for the evaluation of alternative and unconventional designs & materials.

    DYNAFORM Modules
    Blank Size Engineering (BSE)
    BSE is widely used for estimating blank size, along with blank nesting for maximum material usage, scrap & piece price. The plug-in is used to predict thinning, thickening & also to generate a forming limit diagram (FLD).

    Formability Simulation (FS)
    FLD copyFS facilitates the rapid development & validation of single-station & progressive die designs. It uncovers hidden problem areas & enables designers to optimize designs based on accurate forming results.

    Die Evaluation (D-Eval)
    Since most tooling designs are done in a CAD environment, DYNAFORM’s D-Eval Module was specially created to support and analyze CAD based tooling and engineering designs.

    Die System Analysis (DSA)dsiDSA efficiently predicts many stamping related concerns within the die production line. It is used to analyze scrap shedding/removal, die structural integrity & sheet metal transferring/handling.

    Optimization Platform
    This module helps users to go beyond identifying problem areas, by incorporating design optimization to improve performance and quality - reducing wrinkling, thinning and tearing.

    System Requirements
    -Operating System: Windows XP/Vista/7/8/8.1/10.
    -Memory (RAM): 1 GB of RAM is required.
    -Hard Disk Space: 700 MB of free space required.
    -Processor: Intel Dual Core processor or later.

    x64 | File Size: 1.9 GB